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Description
- 2D arrays of holes for wavefront sensing
- Etched into silicon using deep reactive ion etching technology
- Possibilities for high-Z materials (Au, W)
Example
2D silicon holes (pitch: 25 µm, holes: 12.5 µm)
2D silicon holes (pitch: 30 µm, holes: 3 µm)
Specifications
Material
typical
Si membr. 10 µm
limit
Si, Au, W
Aspect ratio
typical
10
limit
> 30
Area
typical
4.5 mm²
limit
> 10 mm²
Hartmann wavefront sensor plates
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