Description

- 2D arrays of holes for wavefront sensing

- Etched into silicon using deep reactive ion etching technology

- Possibilities for high-Z materials (Au, W)

Example

2D silicon hartmann wavefront plate

2D silicon holes (pitch: 25 µm, holes: 12.5 µm)

2D silicon holes hartman sensor plate

2D silicon holes (pitch: 30 µm, holes: 3 µm)

Specifications

Material

typical

Si membr. 10 µm

limit

Si, Au, W

Aspect ratio

typical

10

limit

> 30

Area

typical

4.5 mm²

limit

> 10 mm²

Hartmann wavefront sensor plates